Materials in microelectronic and optoelectronic packaging / edited by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla
(Ceramic transactions ;v. 33 )
データ種別
図書
出版者
Westerville, Ohio : American Ceramic Society
出版年
c1993
本文言語
英語
大きさ
viii, 471 p. : ill. ; 24 cm
所蔵情報を非表示
1
秋田公立美術大学
配架場所
巻 次
請求記号
登録番号
状 態
ISBN
刷 年
利用注記
予約
指定図書
閉架書庫
549 || Ma71
0096461
0944904637
1993
書誌詳細を非表示
一般注記
"Proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic Packaging, presented at the third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992"--T.p. verso Includes bibliographical references and index
著者標目
Ling, Hung C. Niwa, Koichi Shukla, Vishwa N. International Symposium on Materials for Optoelectronic and Microelectronic Packaging (1992 : San Francisco, Calif.)International Ceramic Science and Technology Congress (3rd : 1992 : San Francisco, Calif.)
件 名
LCSH:Microelectronic packaging -- Materials 全ての件名で検索 LCSH:Optoelectronic devices -- Materials 全ての件名で検索
分 類
LCC:TK7874 DC20:621.381/046
書誌ID
2000033084
ISBN
0944904637
NCID
BA20748989
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