Multilayer ceramic substrate-technology for VLSI package/multichip module / K. Otsuka
| データ種別 | 図書 |
|---|---|
| 版 | English language ed |
| 出版者 | London ; New York : Elsevier Applied Science |
| 出版年 | c1993 |
| 本文言語 | 英語 |
| 大きさ | xiii, 242 p. : ill. ; 25 cm |
所蔵情報を非表示
1
秋田公立美術大学
| 配架場所 | 巻 次 | 請求記号 | 登録番号 | 状 態 | コメント | ISBN | 刷 年 | 利用注記 | 予約 | 指定図書 |
|---|---|---|---|---|---|---|---|---|---|---|
| 閉架書庫 |
|
549.7 || O88 | 0092334 |
|
185166579X | 1993 |
|
|
書誌詳細を非表示
| 別書名 | 原タイトル:Seramikku tasō haisen kiban |
|---|---|
| 一般注記 | Translation of: Seramikku tasō haisen kiban Includes bibliographical references (p. 223-231) and index |
| 著者標目 | *大塚, 寛治 <オオツカ, カンジ> 大塚, 寛治 <オオツカ, カンジ> |
| 統一書名標目 | Seramikku tasō haisen kiban |
| 件 名 | LCSH:Electronic ceramics LCSH:Electronic packaging -- Materials LCSH:Intergrated circuits -- Very large scale integration -- Design and construction LCSH:Aluminum oxide |
| 分 類 | LCC:TK7871.15.C4 DC20:621.39/5 |
| 書誌ID | 2000033077 |
| ISBN | 185166579X |
| NCID | BA24514334 |
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