Materials in microelectronic and optoelectronic packaging / edited by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla
| データ種別 | 図書 |
|---|---|
| 出版者 | Westerville, Ohio : American Ceramic Society |
| 出版年 | c1993 |
| 本文言語 | 英語 |
| 大きさ | viii, 471 p. : ill. ; 24 cm |
所蔵情報を非表示
1
秋田公立美術大学
| 配架場所 | 巻 次 | 請求記号 | 登録番号 | 状 態 | コメント | ISBN | 刷 年 | 利用注記 | 予約 | 指定図書 |
|---|---|---|---|---|---|---|---|---|---|---|
| 閉架書庫 |
|
549 || Ma71 | 0096461 |
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0944904637 | 1993 |
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|
書誌詳細を非表示
| 一般注記 | "Proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic Packaging, presented at the third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992"--T.p. verso Includes bibliographical references and index |
|---|---|
| 著者標目 | Ling, Hung C. Niwa, Koichi Shukla, Vishwa N. International Symposium on Materials for Optoelectronic and Microelectronic Packaging (1992 : San Francisco, Calif.) International Ceramic Science and Technology Congress (3rd : 1992 : San Francisco, Calif.) |
| 件 名 | LCSH:Microelectronic packaging -- Materials LCSH:Optoelectronic devices -- Materials |
| 分 類 | LCC:TK7874 DC20:621.381/046 |
| 書誌ID | 2000033084 |
| ISBN | 0944904637 |
| NCID | BA20748989 |
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